Impedance Controlled PCB Differential Impedance Circuit Board 8 Layer PCB for Wireless HDMI
1.1 General description
This is a type of 8 layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of Wireless HDMI. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. It's also an impedance controlled PCB with single-end impedance and differential impedance controlled on on top layer and bottom layer. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.
1.2 Features and benifits
Lead free assemblies with a maximum reflow temperature of 260℃
High solderability, no stressing of circuit boards and less contamination of PCB surface.
AOI inspection
8000 types of PCB per month
12 hours quotation
Free-of-charge PCB panelization
1.3 Applications
USB Adapter
WiFi USB Dongle
GPRS Modem
1.4 Parameter and data sheet
| PCB SIZE | 109.3 x 107.41mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 8 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 1 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 2 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 3 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 4 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 5 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 6 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 18um(0.5oz)+plate BOT Layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3/6.19mm |
| Number of Different Holes: | 24 |
| Number of Drill Holes: | 5158 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | Single-Ended Trace Width:L1, L3, L6, L8 4mils --- 50 ohm, Differential trace/space: top layer 5.1/6.0 mils -- 90 ohm, 5.1 / 8 mils --- 100 ohm, L6 5.1 / 8 mils --- 100 ohm; bottom layer 5.1 mil /6 mils --- 90 ohm, 5.1mils / 8 mils --- 100 ohm |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (26.1% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, stamp holes. |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), Via in pad, Resin via plug, via capped. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 Characteristic Impedance
The characteristic impedance of the conductor on the printed circuit board is an important indicator of the circuit design, especially in the PCB design of high frequency circuit. Whether the characteristic impedance of the conductor is consistent and matching with the characteristic impedance required by the device or signal must be taken into consideration. Therefore, these two concepts in reliability design of PCB design must be paid attention.
There will be a variety of signal transmission in the conductor of circuit board. To increase the rate of transmission, it must increase its frequency. Due to the factors of the circuit itself such as etching, stack thickness, track width and so on are different, it will cause changes of the impedance value, resulting in its signal distortion. Therefore, the impedance value of conductor on high-speed circuit board should be controlled within a certain range, known as the "impedance control". The factors that affect the impedance of the PCB wiring are mainly the width of the copper track, the thickness of the copper track, the dielectric constant of the dielectric, the thickness of the dielectric, the thickness of the pad, the path of the ground layer, the wires around the wiring, etc. So the impedance of the wiring on the board must be controlled in the design of the PCB to avoid signal reflection and other electromagnetic interference and signal integrity issues as far as possible, to guarantee the stability of the actual use of the PCB board. You can refer to the corresponding empirical formula for the calculation method of micro-strip line and strip line impedance on PCB board.
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