Presenting our high-performance double-layer rigid PCB, carefully crafted with Rogers RT/duroid 6035HTC material. Designed for high-power RF and microwave scenarios where thermal management and reliable performance are vital, it stands out as an excellent option for power amplifiers, couplers, and related applications.
PCB Stack-up
The stack-up of this PCB is skillfully designed as follows:
Copper_layer_1: 35 μm
RT/duroid 6035HTC: 0.762 mm (30mil)
Copper_layer_2: 35 μm
PCB details
| Parameter | Specification |
| Base Material | RT/duroid 6035HTC |
| Layer Count | Double sided |
| Board Dimensions | 99.8mm x 61.6 mm=1PCS, +/- 0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.8mm |
| Finished Cu Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% tested prior to shipment |
What Makes RT/duroid 6035HTC Material Stand Out?
Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites, specifically tailored for high power RF and microwave applications, making them an exceptional choice in such scenarios. These laminates boast a thermal conductivity almost 2.4 times that of standard RT/duroid 6000 products, along with copper foil (ED and reverse treat) that offers excellent long-term thermal stability.
What's more, Rogers' advanced filler system enables excellent drill-ability, reducing drilling costs compared to standard high thermally conductive laminates that use alumina fillers. Key features include a dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C, a dissipation factor of 0.0013 at 10 GHz/23°C, and a thermal coefficient of dielectric constant of -66 ppm/°C. It also has a moisture absorption of 0.06%, high thermal conductivity of 1.44 W/m/K at 80°C, CTE in X-axis and Y-axis of 19 ppm/°C, Z-axis of 39 ppm/°C, UL 94-V0 flammability rating, and lead-free process compatibility.
Benefits
-High Thermal conductivity
-Improved dielectric heat dissipation enables lower operating temperatures for high power applications
-Excellent high frequency performance
-Lower insertion loss and excellent thermal stability of traces
Where Can It Be Used?
The unique properties of RT/duroid 6035HTC make this PCB suitable for a range of applications:
-High power RF and microwave amplifiers
-Power amplifiers, couplers, filters, combiners, power dividers
Compliance & Availability
This PCB adheres to rigorous IPC-Class-2 standards, guaranteeing consistent quality and dependable performance. The artwork provided is in Gerber RS-274-X format, enabling smooth integration into production workflows.
We provide global availability, ensuring this premium PCB is accessible to engineers and manufacturers worldwide.
RT/duroid 6035HTC PCB combines outstanding thermal performance, high-frequency functionality, and reliability—making it ideal for high-power RF and microwave applications. Thanks to its exceptional material properties and thoughtful design, it is well-suited to meet the requirements of power-intensive projects. Opt for this PCB to benefit from a solution that excels in both performance and practicality.
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30mil RT duroid 6035HTC PCB Double-layer with Immersion Gold Images
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